In conventional ICs, all active circuitry rests on the silicon
substrate, with additional layers of insulators and interconnects
used only for wiring and mechanical strength. In contrast,
SanDisk's unique 3D architecture deposits multiple layers of active
memory elements on a standard silicon substrate (or silicon
surface) so that active circuitry is no longer confined to the
silicon base but extends vertically as well. This novel approach
enables SanDisk to build chips with a much smaller die area for a
given density than existing technologies, optimizing use of
expensive silicon real estate and dramatically increasing
manufacturing yields while lowering costs.
SanDisk 3D OTP is available in an 8 x 14mm, 32-pin TSOP and is
designed to meet the increasing storage requirements of advanced
portable electronics such as smart phones, PDAs, GPS receivers,
audio/video players, gaming handsets, and electronic toys. 3D OTP
is the ideal storage solution for storing music, video, games,
maps, reference material, and a variety of other rich, multimedia
applications that require low cost, OTP, high capacity, secure,
non-volatile memory. 3D OTP is available in capacities from 512Mb
to 2Gb.
SanDisk 3D OTP Memory's low cost, coupled with its programming
flexibility and time-to-market advantage over Mask ROM, make it the
solution of choice in the embedded storage market. SanDisk 3D OTP
Memory uses a standard NAND interface for seamless integration into
customized portable designs.
SanDisk offers a full, Quick-Turn Programming Service that meets
the critical cost and schedule requirements of content providers,
designers, and OEMs.
3D-OTP Solutions Brochures
3D-OTP Memory Brochures